What is BGA mean?

BGA (Ball Grid Array) is one type of packaging for surface-mounted integrated electronic circuits (integrated circuits whose components are actually 'mounted' or affixed on the surface of the printed circuit semiconductor board). A BGA package simply looks like a thin wafer of semi-conducting material that has circuit components on only one face. The Ball Grid Array package is called such because it is basically an array of metal alloy balls arranged in a grid.

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